Precision, Purity, and Performance in Thin-Film Coating
NanoMatter's Production-Grade PVD systems deliver advanced thin-film coatings using magnetron sputtering for high-purity metals, oxides, and nitrides. Engineered for research and back-end semiconductor production, our platforms combine scalability with exceptional process control.
What is PVD?
Physical Vapor Deposition (PVD) is a vacuum-based coating process where materials such as Aluminum, Titanium, Titanium Oxide, and Titanium Nitride are deposited atom by atom onto substrates using magnetron sputtering.
The result is ultra-clean, uniform, and adherent thin films ideal for semiconductor, optical, and protective applications.
Key Features
Multi-Target Magnetron Sputtering
For complex material stacks with precise composition control.
Reactive Gas Control
Enables oxide/nitride formation with precise stoichiometry.
Process Flexibility
DC, RF, and pulsed-DC power options for diverse materials.
In-situ Monitoring
Ensures uniform film thickness and composition.
Modular Design
Easy upgrade path from R&D to production.
Applications
Semiconductor
Back-end coating
MEMS & Sensors
Precision coatings
Optical Filters
Precision optical coatings
Protective Coatings
Hard & decorative
Technical Specifications
| Parameter | Specification |
|---|---|
| Chamber Type | High-vacuum stainless steel |
| Base Pressure | < 1×10⁻⁶ Torr |
| Target Materials | Al, Ti, TiO₂, TiN |
| Substrate Size | Up to 200 mm |
| Power Supply | DC / RF (up to 2 kW) |
| Gases | Ar, O₂, N₂ |
| Deposition Rate | 0.1–10 nm/s |
AI Optimized
Discover settings for maximum performance and reliability
Unscheduled Downtime
AI-driven monitoring minimizes unexpected equipment failures.
Yields
Optimized process parameters improve material and device yield.
Device Performance
Precise control ensures consistent and high-performance devices.
Device Reliability
AI-enhanced stability improves long-term device reliability.